Vkansee Raises Additional $10M to Fuel Biometric Sensor Innovation
Vkansee, creator of the world’s first under-glass and most secure, patented and ultra-thin optical fingerprint sensor, today announced $10M in additional funding.
The new financing comes from existing angel investors and other institutional investors, including Infotech Ventures, Yunnan Huizhong Fund, Shenzhen Qianhai Greatwall Fund and Superpix Micro Technology.
This funding brings the total invested capital to date to $12M. The secured financing will allow Vkansee to accelerate their growth, develop new products and commercially mass produce and distribute its high resolution sensor to meet demand for higher biometric authentication security on laptops, phones and other mobile devices.
Immediately, the funding will support the production of test wafers for manufacturers and suppliers to evaluate the sensors for device integration in 2017.
Vkansee will make the first 200 evaluation kits available for testing in January at the Consumer Electronics Show in Las Vegas, where Vkansee will also unveil a new prototype at Booth # 21946.
The capital raised will also fuel research and development to improve biometric technology and commercialize follow-on IP. Vkansee uses novel methods of pin-hole imaging to capture fingerprints under-glass or further integrated with display screens to realize design goals while simplifying the biometrics integration for any device with a screen.
Vkansee will drive innovation for greater security against fingerprint hacks on personal mobile devices and other digital security entry points, including wearables and other IoT concepts.
“Bringing security-grade optical fingerprinting to personal devices has always been our priority and passion, and this recent infusion of capital will support delivery of this technology directly to consumers,” said Jason Chaikin, President of Vkansee. “We’re excited about the initial responses received from major industry players and look forward to seeing our sensors in the market and on phones and other technology in the near future.”